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Microelectronics Reliability

Volumn 44, Issue 4, 2004, Pages 651-655

Evaluation of MUMPS polysilicon structures for thermal flow sensors

(3) Leon I a Amador, R a Kohlhof, K b

a Microelectronics Research Center (Cuba)

b NONE (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ANEMOMETERS; ANNEALING; CHEMICAL VAPOR DEPOSITION; DOPING (ADDITIVES); FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MASS TRANSFER; MICROSTRUCTURE; POLYCRYSTALLINE MATERIALS; POLYSILICON; SCANNING ELECTRON MICROSCOPY; SENSORS; THERMISTORS;

POLYSILICON STRUCTURES; THERMAL FLOW SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 1542506139 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/j.microrel.2003.10.011 Document Type: Conference Paper

Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.