SCOPUS 정보 검색 플랫폼

Volumn 21, Issue , 2003, Pages 183-190

Evaluation of mechanical quality of CMP pads using acoustic techniques

(8) Zantye, Parshuram a,b Sikder, A K b Kumar, Ashok a,b Belyaev, A a,b Tarasov, I a,b Dallas, William a,b Ostapenko, S a,b Harmon, Julie b

a University of South Florida (United States)

b UNIVERSITY OF SOUTH FLORIDA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC MECHANICAL ANALYSIS (DMA); FLEXURAL DEFORMATION; POLISHING PADS; WAFER PLANARITY;

DEFORMATION; FILLERS; FOAMS; IMPREGNATION; NONDESTRUCTIVE EXAMINATION; OPTIMIZATION; POLYURETHANES; RELAXATION PROCESSES; ULTRASONIC TESTING; ULTRASONIC TRANSMISSION; VISCOELASTICITY;

CHEMICAL MECHANICAL POLISHING;

EID: 3042808747 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (1)

References (10)

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2
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- O'Mara, W.¹

5
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- Desai, M.¹ Jairath, R.² Stell, M.³ Tolles, R.⁴

6
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- Li, I.¹ Forsthoefel, K.M.² Richardson, K.A.³ Obeng, Y.S.⁴ Easter, W.G.⁵ Maury, A.⁶

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10
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- Totzke, D.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.