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Volumn 750, Issue , 2002, Pages 561-566
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Metrology issues in Cu-low-k chemical mechanical planarization
a,b b b a,b a,b |
Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DIELECTRIC MATERIALS;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICA;
TRIBOLOGY;
CHEMICAL MECHANICAL PLANARIZATION;
CHEMICAL MECHANICAL POLISHING;
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EID: 0042466532
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-750-y9.7 Document Type: Conference Paper |
Times cited : (1)
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References (12)
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