SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 113-118

Investigation of mechanical integrity and its effect on polishing for novel polyurethane polishing pad

(6) Zantye, Parshuram a,b Mudhivarthi, S a,b Sikder, A K b Kumar, Ashok a,b Ostapenko, S a,b Harmon, Julie b

a University of South Florida (United States)

b UNIVERSITY OF SOUTH FLORIDA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC EMISSION TESTING; ACOUSTIC EMISSIONS; DIELECTRIC MATERIALS; DYNAMIC MECHANICAL ANALYSIS; FRICTION; MICROELECTRONIC PROCESSING; POLYURETHANES; ULTRASONICS; WSI CIRCUITS;

INTER METAL DIELECTRICS (IMD); MECHANICAL INTEGRITY; POLISHING PADS; ULTRASOUND TESTING (UST);

CHEMICAL MECHANICAL POLISHING;

EID: 4544351205 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-816-k4.7 Document Type: Conference Paper

Times cited : (3)

References (11)

1
- 0003508875
- Wiley-Interscience, New York
- J.M. Steigerwald, S.P. Murarka, R.J. Gutmann, Chemical Mechanical Planarization of Microelectronic Materials, Wiley-Interscience, New York, 1997
- (1997) Chemical Mechanical Planarization of Microelectronic Materials
- Steigerwald, J.M.¹ Murarka, S.P.² Gutmann, R.J.³

2
- 0031270478
- November
- Z. Stavreva, D. Zeidler, M. Plötner and K. Drescher, Microelectronic Engineering, Volumes 37-38, November 1997, Pages 143-149
- (1997) Microelectronic Engineering , vol.37-38 , pp. 143-149
- Stavreva, Z.¹ Zeidler, D.² Plötner, M.³ Drescher, K.⁴

3
- 32044437276
- P. Singer, Semiconductor Int. 2 (1994) 48
- (1994) Semiconductor Int. , vol.2 , pp. 48
- Singer, P.¹

4
- 3042806589
- W. O' Mara, Semiconductor Int. 7 (1994) 140 M. Desai, R. Jairath, M. Stell, and R. Tolles, Advanced Metallization of Devices and Circuits- Science Technology and Manufacturability, p. 99
- (1994) Semiconductor Int. , vol.7 , pp. 140
- O'Mara, W.¹

5
- 3042762667
- W. O' Mara, Semiconductor Int. 7 (1994) 140 M. Desai, R. Jairath, M. Stell, and R. Tolles, Advanced Metallization of Devices and Circuits- Science Technology and Manufacturability, p. 99
- Advanced Metallization of Devices and Circuits- Science Technology and Manufacturability , pp. 99
- Desai, M.¹ Jairath, R.² Stell, M.³ Tolles, R.⁴

6
- 3042850229
- D. G. Totzke, et. al. NIST conference, 2001, pp. 259
- (2001) NIST Conference , pp. 259
- Totzke, D.G.¹

7
- 0036771076
- September
- H. Lu, Y. Obeng and K. A. Richardson, Materials Characterization, Volume 49, Issue 2, September 2002, Pages 177-186
- (2002) Materials Characterization , vol.49 , Issue.2 , pp. 177-186
- Lu, H.¹ Obeng, Y.² Richardson, K.A.³

8
- 12744271223
- Li I, Forsthoefel KM, Richardson KA, Obeng YS, Easter WG, Maury A. Mater Res Soc Symp Proc 2000;E7: 3.1.
- (2000) Mater Res Soc Symp Proc , vol.E7
- Li, I.¹ Forsthoefel, K.M.² Richardson, K.A.³ Obeng, Y.S.⁴ Easter, W.G.⁵ Maury, A.⁶

9
- 12744271224
- MS Thesis, University of South Florida, Tampa, FL, May
- D Totzke, MS Thesis, University of South Florida, Tampa, FL, May 2000
- (2000)
- Totzke, D.¹

10
- 0035742113
- A.K. Sikder, et.al, Mat. Res. Soc. Symp. Proc. Vol 671, (2001), pp M1.8.1
- (2001) Mat. Res. Soc. Symp. Proc. , vol.671
- Sikder, A.K.¹

11
- 0035737991
- Dec
- A.K. Sikder, et.al, Journal of Electronic Materials, Dec 2001. pp 1520-1526
- (2001) Journal of Electronic Materials , pp. 1520-1526
- Sikder, A.K.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.