Dynamic Mechanical Analysis (DMA) of CMP pad materials

Materials Research Society Symposium - Proceedings

Volumn 613, Issue , 2000, Pages

  Li, I ^a   Forsthoefel, K M ^a   Richardson, K A ^a   Obeng, Y S ^a   Easter, W G ^a   Maury, A ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DAMPING; DYNAMIC MECHANICAL ANALYSIS; ELASTOMERS; HIGH TEMPERATURE PROPERTIES; POLYESTERS; SILICA; SLURRIES; STIFFNESS;

CHEMICAL EXPOSURE; PAD MATERIALS;

POLYURETHANES;

EID: 0034433897     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-613-e7.3.1     Document Type: Conference Paper

References (5)

1. Mechanistic aspects of the relationship between CMP consumables and polishing characteristics