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Volumn 767, Issue , 2003, Pages 119-125

Effect of Pad Surface Texture and Slurry Abrasive Concentration on Tribological and Kinetic Attributes of ILD CMP

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ELASTOHYDRODYNAMIC LUBRICATION; TEXTURES; TRIBOLOGY;

EID: 0242291001     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f2.8     Document Type: Conference Paper
Times cited : (9)

References (11)
  • 1
    • 0035737991 scopus 로고    scopus 로고
    • Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process
    • A.K. Sikder, Frank Giglio and John Wood. Optimization of tribological properties of silicon dioxide during the chemical mechanical planarization process. Journal of Electronic Materials, 30(12):1520-1526 (2001).
    • (2001) Journal of Electronic Materials , vol.30 , Issue.12 , pp. 1520-1526
    • Sikder, A.K.1    Giglio, F.2    Wood, J.3
  • 2
    • 0242304682 scopus 로고    scopus 로고
    • Effect of tribological properties of florine-doped silicon di-oxide films on chemcical mechanical planarization
    • A.K. Sikder, S. Thagella, U.C. Bandugilla, and Ashok Kumar. Effect of tribological properties of florine-doped silicon di-oxide films on chemcical mechanical planarization. Materials Research Society, 697:1-7 (2001).
    • (2001) Materials Research Society , vol.697 , pp. 1-7
    • Sikder, A.K.1    Thagella, S.2    Bandugilla, U.C.3    Kumar, A.4
  • 6
    • 0001611894 scopus 로고
    • The theory and design of plate glass polishing machines
    • F.J. Preston. The theory and design of plate glass polishing machines. J. Soc. Glass Technology, No. 11, 214-256 (1927).
    • (1927) J. Soc. Glass Technology , Issue.11 , pp. 214-256
    • Preston, F.J.1
  • 9
    • 0030781946 scopus 로고    scopus 로고
    • Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads
    • Z. Stavreva, D. Zeidler, M. Plotner and K. Drescher. Characteristics in chemical-mechanical polishing of copper: Comparison of polishing pads. Applied Surface Science, 108:39-44 (1997).
    • (1997) Applied Surface Science , vol.108 , pp. 39-44
    • Stavreva, Z.1    Zeidler, D.2    Plotner, M.3    Drescher, K.4
  • 11
    • 0032139417 scopus 로고    scopus 로고
    • Modeling of chemical-mechanical polishing with soft pads
    • F.G. Shi, B. Zhao. Modeling of chemical-mechanical polishing with soft pads. Applied Physics A, 67:249-252 (1998).
    • (1998) Applied Physics A , vol.67 , pp. 249-252
    • Shi, F.G.1    Zhao, B.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.