Applicability of dynamic mechanical analysis for CMP polyurethane pad studies

Materials Characterization

Volumn 49, Issue 2, 2002, Pages 177-186

  Lu, H ^a,c   Obeng, Y ^b   Richardson, K A ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b psiloQuest Inc   (United States)

^c NONE   (United States)

Author keywords

Chemical mechanical polishing; Dynamic mechanical analysis; Polyurethane

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DEGRADATION; DYNAMIC MECHANICAL ANALYSIS; ELASTICITY; GLASS TRANSITION; INTERFACES (MATERIALS); STRENGTH OF MATERIALS;

PAD-WAFER INTERFACES;

POLYURETHANES;

EID: 0036771076     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(03)00004-4     Document Type: Article

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