Advances in characterization of CMP consumables

MRS Bulletin

Volumn 27, Issue 10, 2002, Pages

  Moinpour, Mansour ^a   Tregub, Alex ^a   Oehler, Andrea ^a   Cadien, Ken ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Chemical mechanical planarization; Chemical mechanical polishing; CMP; Consumables; Integrated circuit (IC) fabrication; Polymer characterization; Rheology

Indexed keywords

AGGLOMERATION; HEAT TREATMENT; INTEGRATED CIRCUIT MANUFACTURE; RHEOLOGY; SLURRIES;

CHEMICAL-MECHANICAL PLANARIZATION (CMP);

CHEMICAL MECHANICAL POLISHING;

EID: 0036802806     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2002.247     Document Type: Article

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