Experimental damage mechanics of micro/power electronics solder joints under electric current stresses

International Journal of Damage Mechanics

Volumn 15, Issue 1, 2006, Pages 41-67

  Ye, Hua ^a   Basaran, Cemal ^b   Hopkins, Douglas C ^b  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b UNIVERSITY AT BUFFALO   (United States)

Author keywords

Damage mechanics; Electromigration; Microelectronics; Nanoelectronics; Power electronics; Solder joint reliability; Solder joints; Thermomigration

Indexed keywords

CRYSTAL GROWTH; ELECTRIC CURRENTS; ELECTROMIGRATION; FAILURE (MECHANICAL); FLIP CHIP DEVICES; INTERFACES (MATERIALS); MICROELECTRONICS; NANOTECHNOLOGY; NUCLEATION; POWER ELECTRONICS; SOLDERING;

DAMAGE MECHANICS; NANOELECTRONICS; SOLDER JOINT RELIABILITY; SOLDER JOINTS; THERMOMIGRATION;

CONTINUUM MECHANICS;

EID: 31544434526     PISSN: 10567895     EISSN: 15307921     Source Type: Journal    
DOI: 10.1177/1056789506054311     Document Type: Article

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