Numerical simulations of electromigration and stress-driven diffusion in polycrystalline interconnects

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 337-342

  Povirk, G L ^a  

^a YALE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIFFUSION IN SOLIDS; ELECTROMIGRATION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; STRESSES;

STRESS DRIVEN DIFFUSION;

POLYCRYSTALLINE MATERIALS;

EID: 0031356655     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-337     Document Type: Conference Paper

References (7)