Measurement and effects of high electrical current stress in solder joints

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 427-432

  Ye, Hua ^a   Hopkins, Douglas C ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Current stressing; Electromigration; FEA; Moir interferometry; Reliability; Solder joint; Strain evolution

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROMIGRATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFEROMETRY; MECHANICAL VARIABLES MEASUREMENT; OPTICAL INTERCONNECTS; RELIABILITY; STRESSES; TIN COMPOUNDS;

HIGH ELECTRICAL CURRENT STRESS; MOIRE INTERFEROMETRY; POWER ELECTRONIC PACKAGING; SOLDER INTERCONNECTS; STRAIN DISTRIBUTION;

SOLDERED JOINTS;

EID: 0036452160     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Lee, T. Y., Tu, K. N., Kuo, S. M., and Frear, D. R., "Electromigration of eutectic SnPb solder interconnects for flip chip technology," Journal of Applied Physics, vol. 89, no. 6, pp. 3189-3194, Mar. 2001.
2. Brandenburg, S. and Yeh, S. Electromigration Studies of Flip Chip Bump Solder Joints. Surface Mount International Conference Proceedings, 1998. 8-23-1998. Ref Type: Conference Proceeding
3. Ye, H., Basaran, C., and Hopkins, D., "Experiment Study on Reliability of Solder Joints under Electrical Stressing -Nano-indentation,Atomic Flux Measurement," Proceedings of 2002 International Conference on Advanced Packaging and Systems, Reno, Nevada, 2002.
4. Ye, H., Basaran, C., Hopkins, D., and Cartwright, A., "Reliability of Solder Joints under Electrical Stressing -Strain evolution of Solder joints," Proceedings from the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm2002), 2002, San Diego, CA, 2002.
5. Post, D., Han, B., and Ifju, P., High Sensitivity Moire New York: Springer, 1994.
6. Chandaroy, Rumpa, "Damage Mechanics of Microelectronic Packaging Under Combined Dynamic and Thermal Loading (Dynamic Loading)." Thesis (PH.D)--STATE UNIVERSITY OF NEW YORK AT BUFFALO. 1998. 279p., 1998.