Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 3, 2003, Pages 673-681

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Deviatoric stress tensor; Electromigration; FE; Hydrostatic stress; PDEs; Stress evolution

Indexed keywords

COMPUTER SIMULATION; DIFFUSION; ELECTROMIGRATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PARTIAL DIFFERENTIAL EQUATIONS; STRAIN; STRESS ANALYSIS; TENSORS;

INTERCONNECT LINES;

ELECTRONICS PACKAGING;

EID: 0142195939     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.817877     Document Type: Article

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