Experiment study on reliability of solder joints under electrical stressing - Nano-indentation, atomic flux measurement

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4828, Issue , 2002, Pages 231-236

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Coarsening; Electromigration; Nano indentation; Reliability; Solder joint

Indexed keywords

CATHODES; CURRENT DENSITY; ELECTRIC CHARGE; ELECTROMIGRATION; EUTECTICS; FLIP CHIP DEVICES; NUCLEATION; STRESS ANALYSIS; TIN COMPOUNDS;

ELECTRICAL STRESSING;

SOLDERED JOINTS;

EID: 0036421378     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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