Mechanical degradation of microelectronics solder joints under current stressing

International Journal of Solids and Structures

Volumn 40, Issue 26, 2003, Pages 7269-7284

  Ye, Hua ^a   Basaran, Cemal ^a   Hopkins, Douglas C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; ELECTRIC CURRENTS; ELECTRIC LOADS; MICROELECTRONICS; THERMAL GRADIENTS;

ELECTRIC CURRENT STRESSING;

SOLDERED JOINTS;

JOINT; SOLDER;

EID: 0242490340     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2003.08.019     Document Type: Article

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