Stress modeling of Cu/low-k BEoL -Application to stress migration

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 234-239

  Zhai, C J ^a   Yao, H W ^a   Besser, P R ^a   Marathe, A ^a   Blish II, R C ^a   Erb, D ^a   Hau Riege, C ^a   Sidharth, ^a   Taylor, K O ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HYDROSTATIC STRESS EFFECTS; INTERFACIAL DIFFUSION; STRESS MIGRATION; STRESS MODELING;

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; COPPER COMPOUNDS; COPPER PLATING; CURRENT DENSITY; ELECTROMIGRATION; FINITE ELEMENT METHOD; LARGE SCALE SYSTEMS; MATHEMATICAL MODELS; PLASTIC DEFORMATION; STRESS ANALYSIS; TENSILE STRESS; X RAY DIFFRACTION;

DIELECTRIC MATERIALS;

EID: 3042566870     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Ogawa E T, McPherson JW, Rosal JA, et al., "Stress-induced Voiding Under Vias Connected to Wide Cu Metal Leads", IRPS, 2002, pp. 312-331
2. Doong, K, Wang R, Lin SC, et al., "Stress-Induced Voiding And Its Geometry Dependency Characterization", IRPS 2003, pp. 156-160
3. von Glasow A, Fisher AH, Hierlemann M, Ungar F, "Geometrical Aspects of Stress-Induced Voiding in Copper Interconnects", pp. 161, AMC, 2002
4. Gan D, Wang G, Ho P, "Effects of Dielectric Material and Line Width on Thermal Stresses of Cu Line Structures", IITC, 2002, pp. 271-273
5. Rhee S H, Du Y, Ho P, "Characterization of thermal stresses of Cu/Iow-k submicron interconnect structures", IITC, 2001, pp 89-91
6. Besser P, Zschech E, Blum W, et al, "Microstructural Characterization of Inlaid Copper Interconnect Lines", Journal of Electronic Materials Vol. 30, No. 4, 320, 2001
7. Lee J, Sauter Mack A, "Finite Element Simulation of a Stress History During the Manufacturing Process Of Thin Film Stacks in VLSI Structures", IEEE Trans Semiconductor Manufacturing, v11, 1998, pp 458-465
8. Hau-Riege, Marathe A, Pham V, "The Effect of Low-k ILD on The Electromigration Reliability of Cu Interconnects With Different Line Lengths", IRPS Proceedings, 2002, pp. 173-177
9. Korhonen M. A, Black RD, Li CY, "Stress evolution due to electromigration in confined metal lines", J. Appl Phys. 73, 1993, pp. 3790
10. Suo Z, "Stable State of Interconnect under Temperature Change and Electric Current", Acta Mater. Vol 46, 1998, pp. 3725-3732
11. Reimbold G, Sicardy O, Arnaud L, et al, "Mechanical Stress Measurements in Damascene Copper Interconnects and Influence on Electromigration parameters", IEDM Proceedings, 2002, pp. 745-748