Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 388-398

  Yang, D G ^a   Zhang, G Q ^b   Ernst, Leo J ^a   Van't Hof, Cornelis ^a   Caers, J F J M ^b   Bressers, H J L ^b   Janssen, J H J ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Curing process; Flip chip; Hydrostatic stress; Solder fatigue; Thermal cycling; Underfill

Indexed keywords

CREEP TESTING; CURING; DESIGN FOR TESTABILITY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

COFFIN-MANSON FATIGUE; FLIP CHIP SOLDER JOINT FATIGUE; HYDROSTATIC STRESS;

ELECTRON DEVICE TESTING;

EID: 0041384488     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815118     Document Type: Article

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