A novel approach for generating boundary condition independent compact dynamic thermal networks of packages

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 593-604

  Codecasa, Lorenzo ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

Compact thermal model; Multivariate moment matching method

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; MATHEMATICAL MODELS; PROBABILITY DENSITY FUNCTION; TEMPERATURE DISTRIBUTION; TOPOLOGY;

COMPACT DYNAMIC THERMAL NETWORKS; COMPACT THERMAL MODELS; MULTIVARIATE MOMENT MATCHING METHOD;

ELECTRONICS PACKAGING;

EID: 29244434083     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859742     Document Type: Article

References (37)

1. jc characterization of chip packages - Justification, limitations and future," IEEE Trans. Compon. Packag. Technol., vol. 12, no. 4, pp. 724-731, Dec. 1989.
2. M. N. Sabry, "Dynamic compact thermal models: An overview of current and potential advances," in Proc. THERMINIC 8, 2002, pp. 1-18.
3. M. N. Sabry, "Dynamic compact thermal models used for electronic design: A review of recent progress," in Proc. IPACK 8, 2003.
4. C. Lasance, H. Vinke, H. Rosten, and K. L. Weiner, "A novel approach for the thermal characterization of electronic parts," in Proc. SEMI-THERM IX, 1995, pp. 1-9.
5. C. Lasance, D. den Hertog, and P. Stehouwer, "Creation and evaluation of compact models for thermal characterization using dedicated optimization software," in Proc. SEMI-THERM XV, 1999, pp. 1-9.
6. C. Lasance, "Two benchmarks to facilitate the study of compact thermal modeling phenomena," IEEE Trans. Comp. Packag. Technol., vol. 24, no. 4, pp. 559-566, Dec. 2001.
7. C. Lasance, "The European project PROFIT: Prediction of temperature gradients influencing the quality of electronic products," in Proc. SEMITHERM XVII, 2001, pp. 120-125.
8. C. Lasance, "Recent progress in compact thermal models," in Proc. SEMI-THERM XIX, 2003, pp. 290-299.
9. F. Christiaens, B. Vandevelde, E. Beyne, R. Mertens, and J. Berghmans, "A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package," IEEE Trans. Comp. Packag. Technol., vol. 21, no. 4, pp. 565-576, Dec. 1998.
10. V. Kyyhkynen, J. Valtanen, and E. Ristolainen, "Synthesis of thermal RC networks for system-in-packages," in Proc. THERMINIC 8, 2002, pp. 241-246.
11. C. Lasance and M. N. Sabry, "The use of time-dependent temperature response curves for the generation of (dynamic) compact thermal models," in Proc. IPACK'03, 2003.
12. Y. Gerstenmaier and G. Wachutka, "Rigorous model and network for transient thermal problems," in Proc. THERMINIC 7, 2001, pp. 5-10.
13. W. Batty, C. E. Christoffersen, A. J. Pamks, S. David, C. M. Snowden, and M. B. Steer, "Electro-thermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex non linear 3-D systems," IEEE Trans. Comp. Packag. Technol., vol. 24, no. 4, pp. 566-590, Dec. 2001.
14. M. Rencz and V. Szekely, "Dynamic thermal multiport modeling of IC packages," IEEE Trans. Comp. Packag. Technol., vol. 24. no. 4, pp. 596-604, Dec. 2001.
15. E. Bosch and M. N. Sabry, "Thermal compact models for electronic systems," in Proc. SEMITHERM XVIII, 2002, pp. 21-29.
16. L. Codecasa, D. D'Amore, and P. Maffezzoni, "Compact thermal networks for modeling packages," IEEE Trans. Comp. Packag. Technol., vol. 27, no. 1, pp. 96-103, Mar. 2004.
17. G. Farkas, A. Poppe, E. Kollar, and P. Stehouwer, "Dynamic compact models of cooling mounts for fast board level design," in Proc. SEMITHERM XIX, 2003, pp. 255-262.
18. M. Rencz, G. Farkas, V. Szekely, A. Poppe, and B. Courtois, "Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements," in Proc. EPTC 5, 2003, pp. 10-12.
19. L. Codecasa, D. D'Amore, and P. Maffezzoni, "A novel approach for generating boundary condition independent compact dynamic thermal networks for packages," in Proc. THERMINIC 10, 2004, pp. 305-310.
20. M. Rencz and V. Szekely, "Studies on the nonlinearity effects in dynamic compact model generation of packages," IEEE Trans. Comp. Packag. Technol., vol. 27, no. 1, pp. 124-130, Mar. 2004.
21. L. Codecasa, D. D'Amore. and P. Maffezzoni, "Compact modeling of electrical devices for electrothermal analysis," IEEE Trans. Circuits Syst. I, vol. 50, no. 4, pp. 465-476, Apr. 2003.
22. L. Codecasa and M. Santomauro, "A new approach to model self-heating of electric circuits through thermal networks," in Proc. ECCTD'99, vol. 1, 1999, pp. 563-566.
23. M. N. Sabry, "Compact thermal models for electronics systems," in Proc. THERMINIC 7, 2001, pp. 197-202.
24. L. Codecasa, "Canonical forms of one-port passive distributed thermal networks," IEEE Trans. Comp. Packag. Technol., vol. 28, no. 1, pp. 5-13, Mar. 2005.
25. J. T. Hsu and L. Vu-Quoc, "A rational formulation of thermal circuit models for electrothermal simulation I. Finite element method," IEEE Trans. Circuits Syst. I, vol. 43, no. 9, pp. 721-732, Sept. 1996.
26. J. T. Hsu and L. Vu-Quoc, "A rational formulation of thermal circuit models for electrothermal simulation II. Model reduction techniques," IEEE Trans. Circuits Syst. I, vol. 43, no. 9, pp. 733-744, Sept. 1996.
27. B. D. Bojanov, H. A. Hakopian, and A. A. Sahakian, Spline Functions and Multivariate Interpolations. Norwell, MA: Kluwer, 1993.
28. M. Gasca and T. Sauer, "Polynomial interpolation in several variables," Adv. Comput. Math., vol. 12. pp. 377-410, 2000.
29. E. Grimme, "Krylov projection methods for model reduction," Ph.D. dissertation, Univ. of Illinois at Urbana-Champaign, Urbana, 1997.
30. D. S. Weile, E. Michielssen, E. Grimme, and K. Gallivan, "A method for generating rational interpolant reduced order models of two-parameter linear systems," Appl. Math Lett., vol. 12, pp. 93-102, 1999.
31. P. Gunupudi and M. Nakhla, "Multi-dimensional model reduction of VLSI interconnects;" in Proc. IEEE CICC, 2000, pp. 499-502.
32. L. Daniel, O. C. Siong, L. S. Chay, K. H. Lee, and J. White, "A multi-parameter moment-matching model-reduction approach for generating geometrically parameterized interconnect performance models," IEEE Trans. Computer-Aided Design, vol. 23, no. 5, pp. 678-693, May 2004.
33. P. Feldmann and R. W. Freund, "Efficient linear circuit analysis by Padé approximation via the Lanczos process," IEEE Trans. Computer-Aided Design, vol. 14, no. 5, pp. 639-649, May 1995.
34. R. W. Freund, "Krylov-subspace methods for reduced-order modeling in circuit simulation," J. Computat. Appl. Math, vil. 123, no. 1-2, pp. 395-421, 2000.
35. L. Codecasa, D. D'Amore, and P. Maffezzoni, "Parameters for multipoint moment matching reduction of thermal networks," in Proc. THERMINIC 8, 2002, pp. 151-154.
36. G. Noebauer, "Creating compact models using spreadsheet software," in Proc. SEMI-THERM XVIII, 2001, pp. 126-133.
37. L. T. Pillage and R. A. Rohrer, "Asymptotic waveform evaluation for timing analysis, "IEEE Trans. Computer-Aided Design, vol. 9, no. 4, pp. 352-366, Apr. 1990.