The use of time-dependent temperature response curves for the generation of (dynamic) compact thermal models

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 363-370

  Lasance, Clemens J M ^a   Sabry, Mohamed Nabil ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b MANSOURA UNIVERSITY   (Egypt)

Author keywords

Compact thermal models; Dynamic; Packages; Thermal analysis; Time dependent; Transient

Indexed keywords

FATIGUE OF MATERIALS; FLUID DYNAMICS; HEAT TRANSFER; MANUFACTURE; NANOTECHNOLOGY; THERMAL EFFECTS; THERMAL GRADIENTS; TRANSISTORS; ELECTRONICS PACKAGING; NANOINDENTATION; PACKAGING; THERMOANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

THERMAL INERTIA; THERMAL MODELS; APPLICATION FIELDS; COMPACT MODEL; COMPACT THERMAL MODELING; COMPACT THERMAL MODELS; DESIGN AND ANALYSIS; DETAILED MODELS; DEVICE FEATURES; DYNAMIC COMPACT THERMAL MODELS; ELECTRONIC CIRCUITS; PACKAGES; POWER PACKAGE; PRACTICAL METHOD; PROBLEM COMPLEXITY; QUAD FLAT PACKS; RESPONSE CURVES; STEADY-STATE MEASUREMENTS; SUBMICRON SCALE; THERMAL ANALYSIS; THERMAL SYSTEMS; TIME-DEPENDENT; TIME-DEPENDENT TEMPERATURE;

NETWORKS (CIRCUITS); DYNAMIC MODELS;

EID: 1242287411     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35167     Document Type: Conference Paper

References (18)

1. Sabry M.N., 2003, "Dynamic Compact Thermal Models: Used for Electronic Design: A Review of Recent Progress", this conference.
2. Ju Y.S., Kading O.W., Wong S.S., Goodson K.E., 1997, "Short-Timescale Thermal Mapping of Semiconductor Devices", IEEE Electron Device Letters 18, pp. 169-171
3. Sylvester D., Kaul H., 2001, "Power-driven Challenges in Nanometer Design", IEEE Design and Test of Computers 18, pp. 12-21
4. Noebauer, G., 2001, "Creating Compact Models Using Spreadsheet Software", Proc. SEMITHERM XVII, pp. 126-133.
5. Rencz M. and Szekely V., 2001, "Dynamic Thermal Multiport Modeling of IC Packages", IEEE Trans. CPT 24, pp. 596-604.
6. Farkas G., Poppe A., Kollar E., Stehouwer P., 2003, "Dynamic Compact Models of Cooling Mounts for Fast Board Level Design", Proc. SEMITHERM XIX, San Jose, CA.
7. th THERMINIC, Madrid, Spain, pp. 10-16.
8. Christiaens F., Vandevelde B., Beyne E., Mertens R., Berghmans J., 1998, "A Generic Methodology for Deriving Compact Dynamic Thermal Models, Applied to the PSGA Package", IEEE CPMT 21, pp. 565-576.
9. Lasance C., 2003, "Recent Progress in Compact Thermal Models", Proc. SEMITHERM XIX, San Jose, CA.
10. th THERMINIC, Madrid, Spain, pp. 241-246.
11. th THERMINIC, Madrid, Spain, pp. 283-289.
12. Bosch E. and Sabry N., 2002, "Thermal Compact Models for Electronic Systems", Proc. of SEMITHERM XVIII, San Jose, CA, pp. 21-29.
13. Lasance C., 2001, "Two Benchmarks to Facilitate the Study of Compact Thermal Modeling Phenomena", IEEE CPT 24, pp.559-566.
14. Lasance C., 2001, "The European Project PROFIT: Prediction of Temperature Gradients Influencing the Quality of Electronic Products" Proc. of SEMITHERM XVII, San Jose, CA, pp. 120-125.
15. Pape H., Schweitzer D., Janssen J., Morelli A., Villa C.M., 2003, "Thermal Transient Modeling and Experimental Validation in the European Project PROFIT", Proc. SEMITHERM XIX, San Jose, CA.
16. Stehouwer P. and den Hertog D., 1999, "Simulation-Based Design Optimisation: Methodology and Applications", Proc. 1th ASMO UK/ISSMO Conf. On Eng. Design and Optimization, UK.
17. Lasance C., den Hertog D., Stehouwer P., 1999, "Creation and Evaluation of Compact Models for Thermal Characterisation Using Dedicated Optimisation Software", Proc. of SEMITHERM XV, San Diego, CA, pp. 189-200.
18. www.cqm.nl