Canonical forms of one-port passive distributed thermal networks

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 5-13

  Codecasa, Lorenzo ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

Passive distributed systems; Structure function; Thermal networks; Time constant representation

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; EIGENVALUES AND EIGENFUNCTIONS; HEAT CONDUCTION; LAPLACE TRANSFORMS; MATHEMATICAL MODELS; POLES AND ZEROS; THEOREM PROVING; THERMODYNAMICS; VECTORS;

PASSIVE DISTRIBUTED SYSTEMS; STRUCTURE FUNCTION; THERMAL NETWORKS; TIME CONSTANT REPRESENTATION;

PASSIVE NETWORKS;

EID: 15744388700     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843182     Document Type: Article

References (18)

1. jc characterization of chip packages - Justification, limitations and future," IEEE Trans. Compon. Packag. Technol., vol. 12. no. 4, pp. 724-731, Dec. 1989.
2. C. Lasance, H. Vinke, H. Rosten, and K. L. Weiner, "A novel approach for the thermal characterization of electronic parts," in Proc. SEMI-THERM IX, vol. 1, 1995, pp. 1-9.
3. C. Lasance, D. den Hertog, and P. Stehouwer, "Creation and evaluation of compact models for thermal characterization using dedicated optimization software," in Proc. SEMI-THERM XV, vol. 1, 1999, pp. 1-9.
4. M. Rencz and V. Szekely, "Dynamic thermal multiport modeling of IC packages," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 4, pp. 596-604, Dec. 2001.
5. M. N. Sabry, W. Fikry, Kh. A. Salam, M. M. Awad, and A. E. Nasser, "A lumped transient thermal model for self-heating in MOSFETs," Microelectron. J., vol. 32, pp. 847-853, 2001.
6. W. Batty, C. E. Christoffersen, A. J. Pamks, S. David, C.M. Snowden, and M. B. Steer, "Electro-thermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-D systems," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 4, pp. 566-590, Dec. 2001.
7. M. N. Sabry, "Dynamic compact thermal models: An overview of current and potential advances," in Proc. THERMINIC 02, vol. 1, 2002, pp. 1-18.
8. L. Codecasa, D. D'Amore, and P. Maffezzoni, "Compact modeling of electron devices for electro-thermal analysis," IEEE Trans. Circuits Syst. I, vol. 50, no. 4, pp. 465-476, Apr. 2003.
9. V. Székely, "On the representation of infinite-length distributed RC one-ports," IEEE Trans. Circuits Syst. I, vol. 38, no. 7, pp. 711-719, Jul. 1991.
10. V. Székely and T. Van Bien, "Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid-State Electron., vol. 21, pp. 1363-1368, 1988.
11. M. R. Rencz and V. Székely, "Measuring partial thermal resistances in a heat-flow path," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 4, pp. 547-553, Dec. 2002.
12. V. Szekely, "Restoration of physical structures: an approach based on the theory of RC networks," in Proc. ECCTD'99 Conf., vol. 2, Stresa, Italy, 1999, pp. 1131-1134.
13. E. N. Protonotarios and O. Wing, "Theory of nonuniform RC lines-Part I: Analytical properties and realizability conditions in the frequency domain," IEEE Trans. Circuit Theory, vol. 14, no. 1, pp. 2-12, Jan. 1967.
14. M. S. Ghausi and J. J. Kelly, Introduction to Distributed Parameter Networks. New York: Holt, Rinehart and Winston, 1968.
15. L. Codecasa, D. D'Amore, P. Maffezzoni, and W. Batty, "Analytical multi-point moment matching reduction of distributed thermal networks," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 1, pp. 87-95, Mar. 2004.
16. M. E. Van Valkenburg, Modern Network Synthesis. New York: Wiley, 1960.
17. W. Rudin, Principles of Mathematical Analysis, 3rd ed. New York: McGraw-Hill, 1976.
18. L. S. Shieh and M. J. Goldman, "Continued fraction expansion and inversion of the cauer third form," IEEE Trans. Circuits Syst. I, vol. 21, no. 3, pp. 341-345, Mar. 1974.