Thermal compact models for electronic systems

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2002, Pages 21-29

  Bosch, E G T ^a   Sabry, M N ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b MENTOR GRAPHICS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ERROR ANALYSIS; HEAT TRANSFER; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; THERMAL EFFECTS;

ELECTRONIC SYSTEMS; ERROR ESTIMATES;

CHIP SCALE PACKAGES;

EID: 0036218158     PISSN: 10652221     EISSN: None     Source Type: Journal    
DOI: 10.1109/STHERM.2002.991341     Document Type: Article

References (21)

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