Compact thermal networks for modeling packages

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 96-103

  Codecasa, Lorenzo ^a   D'Amore, Dario ^a   Maffezzoni, Paolo ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

Ball grid array (BGA) package; Modeling; Packages; Thermal networks

Indexed keywords

ALGORITHMS; BOUNDARY CONDITIONS; DIFFERENTIAL EQUATIONS; INTEGRAL EQUATIONS; MATHEMATICAL MODELS; SPECIFIC HEAT OF SOLIDS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL DIFFUSION IN SOLIDS; THERMAL EFFECTS;

BALL GRID ARRAY PACKAGE; HEAT DIFFUSION; HEAT SOURCE; THERMAL NETWORK;

ELECTRONICS PACKAGING;

EID: 2442587305     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.825796     Document Type: Article

References (11)

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