Dynamic thermal multiport modeling of IC packages

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 596-604

  Rencz, Márta ^a,b   Székely, Vladimir ^c  

^a IEEE   (Hungary)

^b MicReD Ltd   (Hungary)

^c BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Package modeling; Reduced order modeling; Thermal modeling

Indexed keywords

THERMAL MULTIPORT MODELING;

BOUNDARY CONDITIONS; COMPUTER SIMULATION; HEAT RESISTANCE; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; THERMOANALYSIS;

ELECTRONICS PACKAGING;

EID: 0035696842     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974946     Document Type: Article

References (21)

1. Measuring thermal resistance is the key to a cool semiconductor
2. Fine structure of heat flow path in semiconductor devices: A measurement and identification method
3. Analysis of thermal transient data with synthetized dynamic models for semi-conductor devices
4. Analysis of laser diode thermal properties with spatial resolution by means of the TRAIT method
5. Thermal characterization of chip packages-Evolutionary development of compact models
6. Creation and evaluation of compact models for thermal characterization using dedicated optimization software
7. Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods
8. A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package
9. Application results of a new thermal benchmark chip
10. Transient thermal measurements for dynamic package modeling: New approaches
11. Comparison of various thermal transient measurement methods on a benchmark package
12. Measuring dynamic thermal multiport parameters of IC packages
13. Convolution calculus in the network theory and identification
14. A new evaluation method of thermal transient measurement results. Special issue of the therminic workshop
15. An alternative method for electro-thermal circuit simulation
16. A step forward in the transient thermal characterization of chips and packages
17. Heat sinks with controlled thermal resistance: An experiment