Effect of solvent evaporation and shrink on conductivity of conductive adhesive

Materials Transactions

Volumn 46, Issue 3, 2005, Pages 704-708

  Jeong, Woo Ju ^a   Nishikawa, Hiroshi ^a   Gotoh, Hideyuki ^b   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Harima Chemicals Inc   (Japan)

Author keywords

Conductive adhesive; Curing; Electric path; Shrink; Solvent evaporation

Indexed keywords

CROSSLINKING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; EVAPORATION; MOLECULAR STRUCTURE; SHRINKAGE; SOLVENTS; THERMOGRAVIMETRIC ANALYSIS;

CONDUCTIVE ADHESIVES; ELECTRIC PATH; POLYMER MATRIX; SHRINK; SOLVENT EVAPORATION;

ADHESIVES;

EID: 19544388776     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.704     Document Type: Conference Paper

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