Conductivity of conductive polymer for flip chip bonding and BGA socket

Microelectronics Journal

Volumn 32, Issue 3, 2001, Pages 197-203

  Sun, M ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE PLASTICS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; PLASTICS FILLERS;

BALL GRID ARRAY (BGA) SOCKETS;

FLIP CHIP DEVICES;

EID: 0035281350     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00153-1     Document Type: Article

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