Curing kinetics and optimal cure schedules for underfill materials

Microelectronics Journal

Volumn 31, Issue 4, 2000, Pages 271-275

  Hsu, D T ^a   Kim, H K ^a   Shi, F G ^a   Tong, H Y ^b   Chungpaiboonpatana, S ^b   Davidson, C ^b   Adams, J M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CATALYSIS; CURING; ELECTRONICS PACKAGING; GLASS TRANSITION; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; REACTION KINETICS; THERMAL EFFECTS;

UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0033900273     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(99)00143-3     Document Type: Article

References (9)

1. Park C.E., Han B.J., Bair H.E. Humidity effects on adhesion strength between solder ball and epoxy underfills. Polymer. 38:(15):1997;3811-3818.
2. Rzepka S., Korhonen M.A., Meusel E., Li C.Y. The effect of underfill and underfill delamination on the thermal stress in flip-chip solder joint. J. Electron. Packag. 120:1998;342-347.
3. Babiarz A.J. Underfill provides flip chip protection. Adv. Packag. 34:1998;34-36.
4. Suryanarayana D., Wu T.Y., Varcoe J.A. Encapsulants used in flip-chip packages. IEEE Trans. Compon. Hybrids Manufact. Technol. 16:(8):1993;858-862.
5. D.M. Shi, K. McKeen, B. Jenson, Advances in flip chip underfill materials cure rates and reliability, Proceedings of the Fourth International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, 1998, pp. 29-32.
6. Chen Y., Chew F., Goodwin C. Determination of curing schedule for advanced packaging materials. Int. J. Microcircuits Electron. Packag. 20:1997;540-544.
7. S.X. Wu, C. Zhang, C.P. Yeh, S. Wille, K. Wyatt, Cure kinetics and mechanical properties of conductive adhesive, Proceedings of the 47th Electronic Components and Technological Conference, 1997, pp. 550-553.
8. Karkanas P.I., Partridge I.K. Modelling the cure of a commercial epoxy resin for applications in resin transfer moulding. Polym. Int. 41:(2):1996;183-191.
9. Wang Q., He T., Xia P., Chen T., Huang B. Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). I. DSC characterization of curing reaction. J. Appl. Polym. Sci. 66:1997;789-797.