Development of chip-on-flex using SBB flip-chip technology

Microelectronics Reliability

Volumn 41, Issue 4, 2001, Pages 525-530

  Kumano, Yutaka ^a   Tomura, Yoshihiro ^a   Itagaki, Minehiro ^a   Bessho, Yoshihiro ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LIQUID CRYSTAL POLYMERS; MICROPROCESSOR CHIPS; POLYIMIDES; SUBSTRATES; THERMAL STRESS;

CHIP-ON-FLEX (COF) TECHNOLOGY; STUD BUMP BONDING (SBB) FLIP-CHIP TECHNOLOGIES;

LSI CIRCUITS;

EID: 0035310413     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00258-4     Document Type: Article

References (8)

1. Solid logic technology versatile high performance microelectronics
2. Development of an anisotropic conductive adhesive film (ACAF) form epoxy resins
3. The contact resistance and reliability of anisotropically conductive film (ACF)
4. Advanced stud-bump-bonding technique for high density MCM
5. Advanced flip-chip bonding technique to organic substrates
6. Stud-bump bonding technique onto an advanced organic substrate for MCM-L
7. MCM-ALIVH using SBB flip-chip bonding technique
8. Development of low cost and reliable resin based PRESS CONTACT Technology