Characteristic study of anisotropic-conductive film for chip-on-film packaging

Microelectronics Reliability

Volumn 41, Issue 12, 2001, Pages 2001-2009

  Chang, Shyh Ming ^a,b   Jou, Jwo Huei ^b   Hsieh, Adam ^a   Chen, Tai Hong ^a   Chang, Ching Yun ^c   Wang, Yung Hao ^c   Huang, Chun Ming ^c  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c WINTEK Corporation   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; CONDUCTIVE FILMS; INTEGRATED CIRCUITS; LIQUID CRYSTALS; POLYIMIDES;

CHIP ON FILM (COF) TECHNOLOGY; CHIP ON GLASS (COG);

CHIP SCALE PACKAGES;

EID: 0035576309     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00221-9     Document Type: Article

References (9)

1. Flip-chip on flex for 3D packaging
2. Au-Sn microsoldering on flexible circuit
3. Reliability investigation for flip-chip on flex using different solder materials
4. Reliability evaluation of chip-on-flex CSP devices
5. Anisotropic conductive adhesive films for flip chip on flex packages
6. Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications
7. Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste
8. Adhesive flip chip bonding on flexible substrates
9. Characteristic study of chip-on-film interconnection