An Innovation in Thermoplastic, Reworkable Adhesive Pastes

Microelectronics International: An International Journal

Volumn 13, Issue 1, 1996, Pages 52-56

  Dietz, R ^a   Peck, D ^a  

^a Diemat Inc   (United States)

Author keywords

Thermoplastic

Indexed keywords

EID: 0003049188     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369610800223     Document Type: Article

References (9)

1. Gilleo, K. et al., ‘Die Attachment for Today's Packaging Challenges', Electronic Packaging and Production, February (1994).
2. Dietz, R. and Winder, L., ‘New Die Attach Material for Hermetic Packaging’, Proceedings EMTAS Conference, February (1983).
3. Dietz., R., ‘Low Temperature Silver Glass Die Attach — A New technology’ Proceedings MEPPE Fall Meeting (1990).
4. Shores, A., ‘Adhesive Bonding Hybrid Microcircuit Substrates with PEEK Thermoplastic Film’, ISHM Journal, Vol. 11, No. 2, 2nd Quarter (1988).
5. Ying, Y., ‘A Novel Approach — Thermoplastic Die Attach Adhesive’, Solid State Technology, September (1987).
6. Saklades, B.C. et al., ‘Thermal Stress Reduction Via Thermoplastic Die-Attach Adhesive’, Microelectronic Manufacturing & Testing, June (1988).
7. Gilleo, K. et al., ‘Thermoplastic Adhesives — The Attachment Solution for Multichip Modules’, Proceedings IEPS Conference, September (1993).
8. Harper, P., ‘Thermoplastic Die Attach for Hermetic Packaging’, Proceedings MCM Conference (1994).
9. Fatemi, H. et al., ‘Aluminium Bond Pad Contamination by Thermal Outgassing of Organic Material from Silver-Filled Epoxy Adhesives, Proceedings IEMT Conference (1987).