Development of low cost, low temperature conductive adhesives

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1031-1035

  Kang, S K ^a   Purushothaman, S ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATED MATERIALS; CONDUCTIVE MATERIALS; COSTS; ELECTRIC POWER SYSTEM INTERCONNECTION; EPOXY RESINS; FILLED POLYMERS; FILLER METALS; HIGH TEMPERATURE APPLICATIONS; INTEGRATED CIRCUIT INTERCONNECTS; JOINT PROSTHESES; METALS; MICROELECTRONICS; NETWORK COMPONENTS; PLASTIC COATINGS; PRINTED CIRCUIT BOARDS; SOLDERING; SUBSTRATES; TEMPERATURE; ELECTRIC CONDUCTIVITY OF SOLIDS; LOW TEMPERATURE PROPERTIES; PRINTED CIRCUIT MANUFACTURE; THERMAL CONDUCTIVITY OF SOLIDS;

DIE-ATTACH APPLICATIONS; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE ADHESIVE MATERIALS; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH TEMPERATURE SOLDERS; METALLURGICAL BONDING; MICROELECTRONIC APPLICATIONS; SOLDER INTERCONNECTIONS; CONDUCTIVE ADHESIVES;

FILLERS; ADHESIVES;

EID: 0031633695     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678840     Document Type: Conference Paper

References (22)

1. N. Koopman, et. al., Microelectronics Packaing Handbook. (R. Tummala, et. al. ed. ), Van Nostrand Reinhold, 1989, p. 361.
2. T. Reiley, et. al., Microelectronics Packaging Handbook. (R. Tummala, et. al. ed. ), Van Nostrand Reinhold, 1989, p. 779.
3. J. Hwang, Solder Joint Reliability, (J. Lau, ed. ), Van Nostrand Reinhold, 1991, p. 38.
4. 4. Schmit, et. al., Principles of Electronic Packaging, (D. Seraphim, et. al. ed. ), McGraw-Hill Book Co., 1989, p. 335.
5. B. R. Allenby, et. al., Proc. Surface Mount Int., San Jose, CA, Aug. 1992, Vol. l. p. l.
6. S. K. Kang, A. Sarkhel, "Lead (Pb)-free Solders for Electronic Packaging", J. Elec. Materials, Vol. 23, 1994, p. 701.
7. H. Steen, "Assessing Lead-Free Solders for Electronics", Elec. Pack. Prod., Dec. 1994, p. 32.
8. H. H. Manko, "Lead-Free Solder-A Status Report", Elec. Pack., Prod., Feb. 1995, p. 70.
9. G. P. Nguyen, et. al., "Conductive Adhesives", Circuits Assembly, Jan. 1993, p. 36.
10. K. Gilleo, "Evaluating Polymer Solders for Pb Free Assembly", Circuits Assembly, Jan. 1994, p. 52, Feb. 1994, p. 50.
11. R. F. Saraf, et. al., "Polymer/Metal Composite for Interconnection Technology", Proc. 45th Elec. Comp. Tech. Conf., Las Vegas, May 1995, p. 1051.
12. K. Gilleo, et. al., "Die Attachment for Today's Packaging Challenges", Elec. Pack. Prod., Feb. 1994, p. 109.
13. C. Gallagher, et. al., "Transient Liquid Phase Sintering Conductive Adhesives", Proc. Surf. Mount Tech. Int. Conf., San Jose, CA, Aug. 1995, p. 568.
14. S. K. Kang, et. al., "New High Conductivity Lead(Pb)-Free Conducting Adhesives", Proc. IEEE Int. Sym. on Electronics & the Environment, Orlando, FL, May 1995.
15. R. Dietz and D. Peck, "An Innovation in Thermoplastic Reworkable Adhesive Pastes", Microeletron. Int. (UK), No. 39, Jan. 1996, p. 52.
16. S. K. Kang, R. Rai and S. Purushothaman, "Development of High Conductivity Lead(Pb)-Free Conducting Adhesives", Proc. 46th Electr. Comp. Tech. Conf., Orlando, FL, May 1996, p. 565.
17. D. Klosterman, L. Li, J. E. Morrris, "Materials Characterization, Conduction Development, Curing Effects on Reliability of Isotropically Conductive Adhesives", Proc. 46th Electr. Comp. Tech. Conf., Orlando, FL, May 1996, p. 571.
18. C. G. Khoo and J. Liu, "Moisture Sorption in Some Popular Conductive Adhesives", Circuit World (UK), Vol. 22, No. 4, July 1996, p. 9.
19. M. Zwolinski, et. al., "Electrically Conductive Adhesives for Surface Mount Solder Replacement", IEEE Trans. 18. Comp. Pack. Manuf. Tech., Part C, Vol. 19, No. 4, Oct. 1996, p. 241.
20. L. Li and J. E. Morris, "Electrical Conduction Models for Isotropically Conductive Adhesive Joints", IEEE Trans. Comp. Pack. Manuf. Tech., Part A, Vol. 20, No. l, March 1997, p. 3.
21. S. Kotthaus, et. al., "Study of Isotropically Conductive Bondigns Filled with Aggregates of Nano-Sized Ag-Particles", IEEE Trans. Comp. Pack. Manuf. Tech., Part A, Vol. 20, No. l, March 1997, p. 15.
22. Y. Iwasa, "Conductive Adhesive for Surface Mount Devices", Electr. Pack., Prod., Nov. 1997, p. 93.