Stoichiometry control during deposition by ion beam sputtering

Journal of Applied Physics

Volumn 92, Issue 8, 2002, Pages 4784-4790

  Nair, Jaya P ^a   Zon, Ilya ^a   Oron, Matti ^a   Popovitz Biro, Ronit ^a   Feldman, Yishay ^a   Lubomirsky, Igor ^a  

^a WEIZMANN INSTITUTE OF SCIENCE   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION CHAMBERS; EXPERIMENTAL DATA; FEEDBACK PARAMETERS; HIGH QUALITY; INCIDENT BEAMS; ION-BEAM SPUTTERING; IONIC EMISSION; NONSTOICHIOMETRIC; SPECIFIC RESISTANCES; SPUTTERING RATE; STOICHIOMETRY CONTROL; TERNARY COMPOUNDS;

ALUMINUM; CHEMICAL COMPOUNDS; REFRACTIVE INDEX; SILICON;

STOICHIOMETRY;

EID: 18744396341     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1502916     Document Type: Article

References (52)

1. P. Sigmund, in Proceedings of Fundamental Processes in Sputtering of Atoms and Molecules, Symposium on the Occasion of the 250th Anniversary of the Royal Danish Academy of Science, Copenhagen, Denmark, 1993 (The Royal Danish Academy of Science and Letters), Vol. 43, p. 7.
2. C.-C. Lee, J.-C. Hsu, and D.-H. Wong, Appl. Surf. Sci. 171, 151 (2001). asu ASUSEE 0169-4332
3. H. Jin-Cherng and L. Cheng-Chung, Appl. Opt. 37, 1171 (1998). apo APOPAI 0003-6935
4. S. Nishizawa, T. Tsurumi, H. Hyodo, Y. Ishibashi, N. Ohashi, M. Yamane, and O. Fukunaga, Thin Solid Films 302, 133 (1997). tsf THSFAP 0040-6090
5. S. Yamamichi, H. Yabuta, T. Sakuma, and Y. Miyasaka, Appl. Phys. Lett. 64, 1644 (1994). apl APPLAB 0003-6951
6. L. Yijie, X. Guangcheng, L. Guijun, L. Jie, and G. Zizhao, Solid State Commun. 87, 167 (1993). ssc SSCOA4 0038-1098
7. M. Yoshitake, T. Nosaka, A. Okamoto, and S. Ogawa, Thin Solid Films 230, 48 (1993). tsf THSFAP 0040-6090
8. R. N. Castellano, J. Vac. Sci. Technol. 17, 629 (1980). jvs JVSTAL 0022-5355
9. E. Daugy, B. Pointu, C. Audry, and C. Hervo, J. Opt. 21, 99 (1990). joq JOOPDB 0150-536X
10. S. M. Arnold and B. E. Cole, Thin Solid Films 165, 1 (1988). tsf THSFAP 0040-6090
11. G. Cheek, N. Inoue, S. Goodnick, A. Genis, C. Wilmsen, and J. B. DuBow, Appl. Phys. Lett. 33, 643 (1978). apl APPLAB 0003-6951
12. M. Cevro and G. Carter, J. Phys. D 28, 1962 (1995). jpd JPAPBE 0022-3727
13. S. B. Krupanidhi, H. Hu, and V. Kumar, J. Appl. Phys. 71, 376 (1992). jap JAPIAU 0021-8979
14. D. J. Lichtenwalner, C. N. Soble, II, R. R. Woolcott, Jr., O. Auciello, and A. I. Kingon, J. Appl. Phys. 70, 6952 (1991). jap JAPIAU 0021-8979
15. T. W. Kim, W. N. Kang, Y. S. Yoon, S. S. Yom, J. Y. Lee, K. Chayeon, H. Lim, and H. L. Park, J. Appl. Phys. 74, 760 (1993). jap JAPIAU 0021-8979
16. M. Aguilar-Frutis, M. Garcia, C. Falcony, G. Plesch, and S. Jimenez-Sandoval, Thin Solid Films 389, 200 (2001). tsf THSFAP 0040-6090
17. M. Aguilar-Frutis, M. Garcia, and C. Falcony, Appl. Phys. Lett. 72, 1700 (1998). apl APPLAB 0003-6951
18. M. Ritala, K. Kukli, A. Rahtu, P. Raisanen, M. Leskela, T. Sajavaara, and J. Keinonen, Science 288, 319 (2000). sci SCIEAS 0036-8075
19. P. V. Patil, D. M. Bendale, R. K. Puri, and V. Puri, Thin Solid Films 288, 120 (1996). tsf THSFAP 0040-6090
20. M. Cevro, Thin Solid Films 258, 91 (1995). tsf THSFAP 0040-6090
21. F. M. D'Heurle and J. M. E. Harper, Thin Solid Films 171, 81 (1989). tsf THSFAP 0040-6090
22. L. Parfitt, M. Goldiner, J. W. Jones, and G. S. Was, J. Appl. Phys. 77, 3029 (1995). jap JAPIAU 0021-8979
23. D. Liang, L. A. Zepeda-Ruiz, and D. J. Srolovitz, J. Appl. Phys. 89, 4105 (2001). jap JAPIAU 0021-8979
24. M. K. Olsson, K. Macak, U. Helmersson, and B. Hjorvarsson, J. Vac. Sci. Technol. A 16, 639 (1998). jva JVTAD6 0734-2101
25. A. Ershov and L. Pekker, Thin Solid Films 289, 140 (1996). tsf THSFAP 0040-6090
26. J. R. Bellingham, W. A. Phillips, and C. J. Adkins, Thin Solid Films 195, 23 (1991). tsf THSFAP 0040-6090
27. C.-C. Lee, D. T. Wei, J.-C. Hsu, and C.-H. Shen, Thin Solid Films 171, 88 (1996). tsf THSFAP 0040-6090
28. P. Sigmund and N. Q. Lam, in Proceedings of Fundamental Processes in Sputtering of Atoms and Molecules, Symposium on the Occasion of the 250th Anniversary of the Royal Danish Academy of Science, Copenhagen, Denmark, 1993 (The Royal Danish Academy of Science and Letters), Vol. 43, p. 255.
29. G. Carter, Thin Solid Films 289, 121 (1996). tsf THSFAP 0040-6090
30. G. Carter, J. Phys. D 27, 1046 (1994). jpd JPAPBE 0022-3727
31. R. E. Johnson and J. Schou, in Proceedings of Fundamental Processes in Sputtering of Atoms and Molecules, Symposium on the Occasion of the 250th Anniversary of the Royal Danish Academy of Science, Copenhagen, Denmark, 1993 (The Royal Danish Academy of Science and Letters), Vol. 43, p. 403.
32. M. Szymonsky, in Proceedings of Fundamental Processes in Sputtering of Atoms and Molecules, Symposium on the Occasion of the 250th Anniversary of the Royal Danish Academy of Science, Copenhagen, Denmark, 1993 (The Royal Danish Academy of Science and Letters), Vol. 43, p. 495.
33. D. W. Hoffman, J. Vac. Sci. Technol. A 8, 3707 (1990). jva JVTAD6 0734-2101
34. S. W. Whangbo, Y. K. Choi, K. B. Chung, H. K. Jang, and C. N. Whang, J. Vac. Sci. Technol. A 19, 410 (2001). jva JVTAD6 0734-2101
35. J. Saraie, S. Goto, Y. Kitao, and Y. Yodogawa, J. Electrochem. Soc. 134, 2805 (1987). jes JESOAN 0013-4651
36. C. H. Lin, H. L. Wang, and M. H. Hon, Surf. Coat. Technol. 90, 102 (1997). sct SCTEEJ 0257-8972
37. K. Koski, J. Holsa, and P. Juliet, Thin Solid Films 339, 240 (1999). tsf THSFAP 0040-6090
38. K. Koski, J. Hoelsae, and P. Juliet, Thin Solid Films 326, 189 (1998). tsf THSFAP 0040-6090
39. B. Hirschauer, S. Soederholm, G. Chiaia, and U. O. Karlsson, Thin Solid Films 305, 243 (1997). tsf THSFAP 0040-6090
40. J. Kolodzey, E. A. Chowdhury, T. N. Adam, Q. Guohua, I. Rau, J. O. Olowolafe, J. S. Suehle, and C. Yuan, IEEE Trans. Electron Devices 47, 121 (2000). etd IETDAI 0018-9383
41. T. Maruyama and S. Arai, Appl. Phys. Lett. 60, 322 (1992). apl APPLAB 0003-6951
42. N. G. Chechenin, J. Bottiger, and J. P. Krog, Thin Solid Films 261, 219 (1995). tsf THSFAP 0040-6090
43. B. K. Tanner, X-ray Diffraction Topography (Pergamon, Oxford, 1976).
44. R. M. A. Azzam, Ellipsometry and Polarized Light (North-Holland, Amsterdam, 1987).
45. P. J. Kelly and R. D. Arnell, J. Vac. Sci. Technol. A 17, 945 (1999). jva JVTAD6 0734-2101
46. P. Kofstad, Oxid. Met. 44, 3 (1995). oxm OXMEAF 0030-770X
47. J. D. Klein and A. Yen, J. Appl. Phys. 70, 505 (1991). jap JAPIAU 0021-8979
48. K. Ishiyama and Y. Taga, Appl. Phys. Lett. 58, 577 (1991). apl APPLAB 0003-6951
49. N. Winograd, in Proceedings of Fundamental Processes in Sputtering of Atoms and Molecules, Symposium on the Occasion of the 250th Anniversary of the Royal Danish Academy of Science, Copenhagen, Denmark, 1993 (The Royal Danish Academy of Science and Letters), Vol. 43, p. 403.
50. L. Dong and D. J. Srolovitz, J. Appl. Phys. 84, 5261 (1998). jap JAPIAU 0021-8979
51. L. Dong and D. J. Srolovitz, Appl. Phys. Lett. 75, 584 (1999). apl APPLAB 0003-6951
52. J. A. Thornton and D. W. Hoffman, Thin Solid Films 171, 5 (1989). tsf THSFAP 0040-6090