The world of thermal characterization according to DELPHI - Part II: Experimental and numerical methods

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 392-398

  Lasance, Clemens J M ^a,b   Rosten, Harvey I ^a,c   Parry, John D ^a,c  

^a IEEE   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c Flomerics Ltd   (United Kingdom)

Author keywords

Behavioral model; Compact model; DELPHI; Detailed model; Experimental; Optimization; Thermal characterization; Thermal design

Indexed keywords

HEAT RESISTANCE; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; OPTIMIZATION; PRODUCT DESIGN;

BEHAVIORAL MODELS; COMPACT MODELS; CRITICAL ELECTRONIC PARTS; THERMAL CHARACTERIZATION; THERMAL DESIGN;

ELECTRONICS PACKAGING;

EID: 0031334642     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650928     Document Type: Article

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