Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh

Solid-State Electronics

Volumn 45, Issue 7, 2001, Pages 1137-1148

  Smy, T ^a   Walkey, D ^a   Dew, S K ^a,b  

^a CARLETON UNIVERSITY   (Canada)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Device; Simulation; Thermal; Transient; Transmission line matrix

Indexed keywords

ALGORITHMS; CAPACITANCE; COMPUTER SIMULATION; ELECTRIC RESISTANCE; ERROR ANALYSIS; MATRIX ALGEBRA; THERMAL CONDUCTIVITY; TRANSIENTS; TRANSMISSION LINE THEORY; TREES (MATHEMATICS);

TRANSIENT THERMAL RESPONSES; TRANSMISSION LINE MATRIX (TLM) METHODS;

INTEGRATED CIRCUITS;

EID: 0035390033     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(01)00066-1     Document Type: Article

References (13)

1. A simple explicit and unconditionally stable numerical routine for the solution of the diffusion equation
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3. Use of three-dimensional TLM method in the thermal simulation and design of semiconductor devices
4. The effects of surface metallization the thermal behavior of GaAs microwave power devices
5. Application of the TLM method to transient thermal simulation of microwave power transistors
6. Thermal properties of power HBT's
7. Combined fine-coarse mesh transmission line modelling for diffusion problems
8. A combined fine-coarse mesh method for the transmission line modelling of diffusion
9. Substructuring of space and time in TLM diffusion applications
10. A 3D thermal simulation tool for integrated devices - Atar
11. Thermal resistance of heat sinks with temperature-dependent conductivity