Challenges in thermal modeling of electronics at the system level: Summary of panel held at the therminic 2000

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 611-613

  Joshi, Yogendra ^a   Baelmans, M ^b   Copeland, D ^c   Lasance, C J M ^d   Parry, J ^e   Rantala, J ^f  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c Showa Aluminum Co Ltd   (Japan)

^d PHILIPS RESEARCH LABORATORIES   (Netherlands)

^e Flomerics   (United Kingdom)

^f NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; HEAT SINKS; THERMOANALYSIS;

THERMAL MODELING;

CONSUMER ELECTRONICS;

EID: 0035691805     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974948     Document Type: Article

References (0)