Thermal sub-modeling of the wirebonded plastic ball grid array package

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 1-9

  Johnson, Zane ^a   Ramakrishna, K ^a   Joiner, Bennett ^a   Eyman, Mike ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT CONDUCTION; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS;

PLASTIC BALL GRID ARRAY; SOLDER SPHERE ARRAY; THERMAL CONSTRICTION EFFECTS; THERMAL VIAS;

ELECTRONICS PACKAGING;

EID: 0030813292     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)