Thermal characterization of chip packages - Evolutionary development of compact models

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 399-409

  Bar Cohen, Avram ^a,b   Krueger, William B ^c  

^a IEEE   (United States)

^b University of Minnesota   (United States)

^c Rosemount Inc   (United States)

Author keywords

Compact thermal models; Expanded R jc; R jA; R jc; Thermal models

Indexed keywords

HEAT RESISTANCE; HEAT TRANSFER; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS;

CHIP PACKAGES; COMPACT THERMAL MODELS;

ELECTRONICS PACKAGING;

EID: 0031336873     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650929     Document Type: Article

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