Hybrid reliability assessment for packaging prototyping

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 597-609

  Lu, Hua ^a   Zhou, Jesse ^b   Golek, Rich ^b   Zhou, Ming ^a  

^a RYERSON UNIVERSITY   (Canada)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER VISION; DEFORMATION; FRACTURE MECHANICS; PHASE SHIFT; SPECKLE; STRAIN; THERMAL EFFECTS;

ACCELERATED THERMAL CYCLE (ATC); DIGITAL SPECKLE CORRELATION; PACKAGING PROTOTYPING;

ELECTRONICS PACKAGING;

EID: 15744388264     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.12.011     Document Type: Article

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