Thermal fatigue life estimation based on CASE failure criterion with measured solder layer strain

Advances in Damage Mechanics

Volumn , Issue , 2003, Pages 489-498

  Das, R ^a   Lu, H ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CREEP; FATIGUE TESTING; GRAIN SIZE AND SHAPE; JOINTS (STRUCTURAL COMPONENTS); MICROELECTRONICS; MICROSTRUCTURE; SOLDERING ALLOYS; STRESSES; THERMAL EXPANSION;

CRITICAL ACCUMULATED STRAIN ENERGY (CASE); STRESS EXPONENTS; TEMPERATURE CYCLING; THERMAL FATIGUE LIFE;

FATIGUE OF MATERIALS;

EID: 2942609148     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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