Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations

Microelectronics Reliability

Volumn 43, Issue 7, 2003, Pages 1137-1144

  Deletage J Y ^a   Verdier, F J M ^a   Plano, B ^a   Deshayes, Y ^a   Bechou, L ^a   Danto, Y ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; EXTRAPOLATION; PROCESS CONTROL; RELIABILITY; THERMAL CYCLING;

DEGRADATION LAW;

MICROELECTRONICS;

EID: 0038451606     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00101-X     Document Type: Conference Paper

References (7)

1. Coffin L. A study of cyclic thermal stresses in a ductile material. Trans. ASME. 76:1954;931-950.
2. Manson S. Behaviour of materials under conditions of thermal stress. Heat Transfer Symposium: Michigan Engineering Research Institute, 1953. p. 9-75.
3. Engelmaier W. Functional cycles and surface mounting attachment reliability. ISHM Technical Monograph Series 6984-002, ISHM, Silver Spring, MD, 1984. p. 87-114.
4. Norris K., Landzberg A. IBM J. Res. Dev. 13:1969;266.
5. Hijazi A. Etude du comportement thermomécanique et de la fiabilité d'assemblages de CMS utilisés en environnement automobile sévère. Thesis Université Bordeaux 1, February 1993.
6. Danto Y, Delétage J-Y, Verdier F, Frémont H. Evolution of reliability assessment in PCB assemblies. Proc XVIth SBMicro, Pirenopolis (Brazil), September 2001. p. 51-9.
7. Evans J.W.et al. Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method. Microelectron. Reliab. 40:2000;1147-1155.