Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages

Microelectronics Reliability

Volumn 43, Issue 2, 2003, Pages 307-318

  Vandevelde, Bart ^a   Degryse, Dominiek ^a   Beyne, Eric ^a   Roose, Eric ^b   Corlatan, Dorina ^b   Swaelen, Guido ^b   Willems, Geert ^b   Christiaens, Filip ^b   Bell, Alcatel ^b   Vandepitte, Dirk ^c   Baelmans, Martine ^c  

^a IMEC   (Belgium)

^b Catholic University of Leuven ^*  (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FORMABILITY; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION;

THERMO-MECHANICAL MODELING;

ELECTRONICS PACKAGING;

EID: 0037302707     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00263-9     Document Type: Conference Paper

References (9)

1. Ries M.D., Banks D.R., Watson D.P., Hoebener K.G. Attachment of solder ball connect (SBC) packages to circuit cards. IBM J. Res. Develop. 37(5):1993;597-608.
2. Ingalls E, Cole M, Jozwiak J, Milkovich C, Stack J. Improvement in reliability with CCGA column density increase to 1 mm pitch. In: Electronic Components and Technology Conference 1998. p. 1298-304.
3. Master RN, Dolbear TP. Ceramic ball grid array for AMD K6 microprocessor application. In: ECTC 98, Seattle, Washington, USA. p. 702-6.
4. Martin GB, Cole Marie S, Brofman JP, Goldmann Lewis S. The effect of substrate thickness on CBGA fatigue life, SMT Conference 97.
5. Corbin J.S. Finite element analysis for solder ball connect (SBC) structural design optimisation. IBM J. Res. Develop. 37(5):1993;585-596.
6. Degryse D, Vandevelde B, Beyne E. Simulation of solder joint reliability for CBGA packages. In: 13th European Microelectronics and Packaging Conference, 30 May-1 June, Strasbourg, France, 2001.
7. Vandevelde B. Thermo-mechanical modelling of solder joint reliability for electronic package systems. PhD thesis work, Catholic University of Leuven and IMEC, March 2002.
8. Manual of MARC-MSC software (www.mscsoftware.com).
9. Manual of LMS Optimus software (www.lms.com).