Warpage studies of HDI test vehicles during various thermal profiling

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 4, 1999, Pages 624-637

  Petriccione, Gregory J ^a   Charles Ume, I ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; IMAGE ANALYSIS; INTERCONNECTION NETWORKS; MOIRE FRINGES; PRINTED CIRCUIT MANUFACTURE; SURFACE MOUNT TECHNOLOGY;

HIGH DENSITY INTERCONNECTS (HDI); OUT-OF-PLANE SURFACE DISPLACEMENTS; PRINTED WIRING BOARDS (PWB); SHADOW MOIRE METHODS;

ELECTRONICS PACKAGING;

EID: 0033349070     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.803455     Document Type: Article

References (8)

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