New thermal fatigue life prediction method for BGA/FBGA solder joints with basic crack propagation study

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1291-1296

  Uegai, Yasumi ^a   Kawazu, Akinobu ^a   Wu, Qiang ^a   Matsushima, Hironori ^a   Yasunaga, Masatoshi ^a   Shimamoto, Haruo ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROCRACKS; THERMAL CYCLING;

BALL GRID ARRAYS (BGA);

SOLDERED JOINTS;

EID: 0036287263     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Isothermal fatigue of 63Sn-37Pb solder
2. A creep-rupture model for two-phase eutectic solders
3. Thermal fatigue damage in Pb-in solder interconnections
4. Low cycle fatigue of surface-mounted chip-carrier/printed wiring board joints
5. Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling
6. A method of fatigue life prediction for surface-mount solder joints of electronic devices by mechanical fatigue test
7. Fatigue crack propagation behavior of 63Sn-37Pb solder
8. Thermal fatigue Life of Pb-Sn alloy interconnections
9. Creep crack growth prediction of solder joints during temperature cycling - An engineering approach
10. Thermomechanical durability analysis of flip chip solder interconnects: Part 2 - With underfill