Solder joint reliability of a lead-less RF-transistor

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 87-91

  Gustafsson, G ^a  

^a ERICSSON RADIO SYSTEMS AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; ELECTRONICS PACKAGING; FORECASTING; NETWORK COMPONENTS; RELIABILITY; COMPUTER SIMULATION; CRACK PROPAGATION; CREEP; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT LOSSES; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; TRANSISTORS;

ACCELERATED TEMPERATURE CYCLING; ACCELERATION FACTORS; BOARD-LEVEL RELIABILITY; FIELD CONDITIONS; PACKAGE MATERIALS; SOLDER JOINT RELIABILITY; THEORETICAL METHODS; THERMAL CONDUCTION;

SOLDERED JOINTS; ELECTRONICS PACKAGING;

LEAD LESS RADIO FREQUENCY (RF) TRANSISTORS; THERMOMECHANICAL RELIABILITY;

EID: 0031643128     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678675     Document Type: Conference Paper

References (2)

1. R. Darveaux, "Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints, " Advances in Electronic Packaging 1995-Proc. of the International Intersociety Electronic Packaging Conference-INTERpack'95, Lahaina, Hawaii, March 26-30, 1995, pp. 675-685
2. R. Darveaux, K. Banerji, A. Mawer, G. Dody, "Reliability of Plastic Ball Grid Array Assembly, " Ball Grid Array Technology, J. Lau, Editor, McGraw-Hill Inc., New York, 1995