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IEEE Transactions on Advanced Packaging

Volumn 24, Issue 2, 2001, Pages 206-215

Chip-scale packaging of power devices and its application in integrated power electronics modules

(3) Liu, Xingsheng a,b Jing, Xiukuan c Lu, Guo Quan d

a IEEE (United States)

b Corning Inc ^* (United States)

c ROCKWELL SCIENCE CENTER (United States)

d State University (United States)

Author keywords

Chip scale packaging; D 2BGA; FCOF; Flip chip; IPEM; Power electronics packaging; Power module

Indexed keywords

POWER DEVICES;

INSULATED GATE BIPOLAR TRANSISTORS; POWER ELECTRONICS; RELIABILITY THEORY; SOLDERED JOINTS;

CHIP SCALE PACKAGES;

EID: 0035329036 PISSN: 15213323 EISSN: None Source Type: Journal
DOI: 10.1109/6040.928756 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.