Thermal fatigue reliability enhancement of plastic ball grid array (PBGA) packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1211-1216

  Syed, Ahmer R ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN; FATIGUE TESTING; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

AUTOMOTIVE UNDER THE HOOD ENVIRONMENT; PLASTIC BALL GRID ARRAY PACKAGES; SOLDER MASK DEFINED PADS; TEMPERATURE PROFILES; THERMAL CYCLE TESTING; THERMAL FATIGUE RELIABILITY ENHANCEMENT;

ELECTRONICS PACKAGING;

EID: 0029699475     PISSN: 05695503     EISSN: None     Source Type: None    
DOI: 10.1109/ECTC.1996.550889     Document Type: Article

References (10)

1. T. R. Lindley BGA Solder Joint Reliability Study for Automotive Electronics Proceedings, 1995 International Conference on Multichip Modules 126 133 Proceedings, 1995 International Conference on Multichip Modules 1995
2. S. C. Bolton A. J. Mawer E. Mammo Influence of Plastic Ball Grid Array Design/Material Upon Solder Joint Reliability The International Journal of Microcircuits and Electronic Packaging 18 2 109 121 1995
3. T. I. Ejim A. Holliday Designed Experiment to Determine Attachment Reliability Drivers for PBGA Packages Proceedings, Surface Mount International 385 392 Proceedings, Surface Mount International 1995
4. C. Ramirez S. Fauser Fatigue Life Comparison of Perimeter and Full Plastic Ball Grid Array (PBGA) Proceedings, Surface Mount International Proceedings, Surface Mount International 1994
5. A. R. Syed Creep Crack Growth Prediction of Solder Joints During Temperature Cycling-An Engineering Approach ASME Journal of Electronic Packaging 117 116 122 June 1995
6. A. R. Syed B., K. Banerjee P. K. Bhatti K Gschwend A. Y. Kwang Effect of Temperature Profile Parameters on Creep Strain Response of Solder Joints in Leaded Surface Mount Devices Proceedings, 1993 ASME International Electronic Packaging Conference 2 1055 1062 Proceedings, 1993 ASME International Electronic Packaging Conference 1993
7. M. C. Shine L. R. Fox Fatigue of Solder Joints in Surface Mount Devices ASTM STP 942, Low Cycle Fatigue 588 610 ASTM STP 942, Low Cycle Fatigue Philadelphia 1988
8. D. S. Steinberg Cooling Techniques for Electronic Equipment 304 305 1991 John Wiley
9. P. K. Bhatti K. Gschwend A. Y. Kwang A. R. Syed Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices ASME Journal of Electronic Packaging 117 20 25 March 1995
10. B Wong D. E Helling R. W Clark A Creep-Rupture Model for Two-Phase Eutectic Solders IEEE CHMT 11 3 284 290 1988