Reliability analysis for fine pitch BGA package

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 737-741

  Wu, S X ^a   Chin, J ^b   Grigorich, T ^a   Wu, Xiaohua ^a   Mui, G ^a   Yeh, Chao Pin ^a  

^a MOTOROLA INC   (United States)

^b NORTHWESTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; DIES; NETWORK COMPONENTS; SOLDERING ALLOYS; SUBSTRATES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; PRODUCT DESIGN;

CHIP-SCALE PACKAGING; DIE-ATTACH MATERIALS; KEY DESIGN PARAMETERS; PARAMETRIC -ANALYSIS; PARAMETRIC FINITE ELEMENTS; SOLDER JOINT FATIGUE; STRUCTURAL DIFFERENCES; TEMPERATURE EXCURSIONS; BALL GRID ARRAYS (BGA); SOFTWARE PACKAGE SURFACE EVOLVER;

RELIABILITY ANALYSIS; ELECTRONICS PACKAGING;

EID: 0031624701     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678789     Document Type: Conference Paper

References (4)

1. Lau, John, Ball Grid Array Technology, McGraw-Hill, Inc. New York, NY, 1995.
2. Brakke, K. A., Surface Evolver Manual, version J. 99, The Geometry Center, 1300 S. Second St., Minneapolis, MN 55454, 1995.
3. Heinrich, S. M., "Prediction of Solder Joint Geometry, " Ch. 5 The Mechanics of Solder Alloy-Interconnects, Van Nostrand Rheinhold., New York, 1994, pp. 158-198.
4. Darveaux, R., Baneiji, K., Mawer, A., Dody G. ., "Reliability of Plastic Ball Grid Array Assembly, " Ball Grid Array Technology, JohnH. Lau, ed., McGraw-Hill, Inc. New York, NY, 1995.