Solder joint reliability study of 256 pin, 0.4 mm pitch, PQFP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 1222-1231

  Yeo, C K ^a   Mhaisalkar, S ^a   Pang, H L J ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; CREEP; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MECHANICAL TESTING; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING; WEIBULL DISTRIBUTION;

ACCELERATED LIFETIME TESTING; PLASTIC QUAD FLAT PACKS; SOLDER JOINT RELIABILITY; SOLDER PASTE;

ELECTRONICS PACKAGING;

EID: 0029695986     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)