Thermomechanical durability of high I/O BGA packages

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 266-270

  Davuluri, P ^a   Shetty, S ^a   Dasgupta, A ^a   Young, S ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042872373     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1477192     Document Type: Article

References (16)

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4. Darveaux, R., 2000, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation," Proceedings of Electronic Components and Technology Conference, May, pp. 1048-1058.
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10. Darbha, K., and Dasgupta, A., "A Nested Finite Element Methodology (NFEM) for Stress Analysis of Flip Chip on Board Assemblies - Part II: Viscoplastic Analysis," ASME J. Electron. Packag., 123, pp. 147-155.
11. Darbha, K., and Dasgupta, A., 1999, "A Nested Finite Element Methodology (NFEM) for Stress Analysis of Flip Chip Solder Interconnects: Part I - Elastic Analysis," Proceedings Interpack '99, Vol. 1, pp. 13-19.
12. Darbha, K., 1999, "A Nested Finite Element Methodology for Virtual Qualification of Area-Array Microelectronic Interconnect Assemblies," Ph.D. Dissertation, University of Maryland College Park.
13. Skipor, A. F., Harren, S. V. and Bolsis, J., 1996, "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder," ASME J. Eng. Mater. Technol., 118, p. 1.
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