Thermo-mechanical analysis of solder joint fatigue and creep in a flip chip on board package subjected to temperature cycling loading

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 878-883

  Pang, J H L ^a   Tan, Tze Ing ^a   Sitaraman, S K ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CONCRETE BEAMS AND GIRDERS; CREEP; FINITE ELEMENT METHOD; NETWORK COMPONENTS; STRAIN; STRESS ANALYSIS; THERMAL FATIGUE; ELASTOPLASTICITY; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; MATHEMATICAL MODELS; PLASTIC DEFORMATION; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING;

CREEP DEFORMATION BEHAVIOR; ENCAPSULATION PROCESS; FATIGUE LIFE PREDICTION MODELS; SOLDER JOINT FATIGUE; THERMO-MECHANICAL ANALYSIS; THERMO-MECHANICAL STRESS; TWO DIMENSIONAL PLANE; UNDERFILL ENCAPSULATION;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

FLIP CHIP ON BOARD (FCOB) PACKAGE;

EID: 0031624696     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678811     Document Type: Conference Paper

References (9)

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