Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading

Finite Elements in Analysis and Design

Volumn 39, Issue 9, 2003, Pages 819-833

  Yang, Q J ^a   Shi, X Q ^a   Wang, Z P ^a   Shi, Z F ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Electronic packaging; FEA; Low cycle fatigue; PBGA; Solder joint

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CRACK PROPAGATION; DEFORMATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LOADS (FORCES); PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL EXPANSION;

PLASTIC BALL GRID ARRAY (PBGA) ASSEMBLIES;

PRINTED CIRCUIT DESIGN;

EID: 0038823751     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(02)00134-8     Document Type: Article

References (7)

1. Lau J.H. Ball Grid Array Technology. 1995;McGraw-Hill, New York.
2. Q.J. Yang, X.Q. Shi, Z.F. Shi, D.J. Xie, Z.P. Wang, Implementation of Reliability Design Methodology for SMD Interconnections, Project Final Report, Gintic Institute of Manufacturing Technology, 2000.
3. Lau J.H., Pao Y.H. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies. 1997;McGraw-Hill, New York.
4. Shi X.Q., Zhou W., Pang H.L.J., Wang Z.P. Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder. ASME J. Electron. Packaging. 121(3):1999;179-186.
5. Shi X.Q., Wang Z.P., Zhou W., Pang H.L.J., Yang Q.J. A new creep constitutive model for eutectic solder alloy. ASME J. Electron. Packaging. 124(2):2002;85-91.
6. Darveaux R., Banerji K., Mawer A., Dody G. Reliability of plastic ball grid assembly. Lau Y. Ball Grid Array Technology. 1995;McGraw-Hill, New York.
7. R. Darveaux, Effect of simulation methodology on solder joint crack growth-correlation, Proceedings of 2000 Electronic Components and Technology Conference, 2000, pp. 1048-1058.