Plasticity-related phenomena in metallic films on substrates

Materials Research Society Symposium - Proceedings

Volumn 779, Issue , 2003, Pages 63-74

  Legros, M ^a   Dehm, G ^b   Balk, T J ^b   Arzt, E ^b   Bostrom, J R O ^c   Gergaud, P ^c   Thomas, O ^c   Kaouache, B ^d  

^a CEMES CNRS   (France)

^b MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^c AIX MARSEILLE UNIVERSITY   (France)

^d UNIVERSITÉ DE LORRAINE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL MICROSTRUCTURE; DEPOSITION; DIFFUSION IN SOLIDS; DISLOCATIONS (CRYSTALS); EPITAXIAL GROWTH; PLASTIC DEFORMATION; PLASTICITY; STRAIN HARDENING; SUBSTRATES; THERMAL CYCLING; THERMAL STRESS;

LASER PROFILOMETRY; MISMATCHED COEFFICIENT OF THERMAL EXPANSION; PLASTICITY RELATED PHENOMENA; STONEY EQUATION;

METALLIC FILMS;

EID: 0344120752     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-779-w4.2     Document Type: Conference Paper

References (47)

1. A.G. Evans and J.W. Hutchinson, Acta Met. Mat. 43 2507-2530 (1995).
2. W.D. Nix, Metall. Trans. A 20A 2217-2245 (1989).
3. G.G. Stoney, Proc. Roy. Soc. Lond. A 82 172 (1909).
4. P.A. Flinn, D.S. Gardner, and W.D. Nix, IEEE Trans. Electron. Dev. 34 689 (1987).
5. L.B. Freund, J. Appl. Mech. 54 553 (1987).
6. L.P. Kubin, "Dislocations and stress relaxation in heteroepitaxial films", Stress and strain in epitaxy: theoretical concepts, measurements and applications., ed. M. Hanbücken and J.-P. Deville., (North Holland, 2001).
7. C.V. Thompson, J. Mater. Res. 8 237-238 (1993).
8. P. Chaudari, Phil. Mag. A 39 507-516 (1979).
9. W.D. Nix, Scripta Mater. 39 545-554 (1998).
10. G. Dehm, B.J. Inkson, T.J. Balk, T. Wagner, and E. Arzt in Dislocations and deformation mechanisms in thin films and small structures, edited by O. Kraft, K.W. Schwarz, S.P. Baker, L.B. Freund, (Mat. Res. Soc. Symp. Proc. 673, Pittsburgh PA, 2001) p. 619.
11. B.J. Inkson, G. Dehm, and T. Wagner, Acta Materialia 50 5033-5047 (2002).
12. G. Dehm, B.J. Inkson, and T. Wagner, Acta Materialia 50 5021-5032 (2002).
13. V. Weihnacht and W. Bruckner, Acta Materialia 49 2365-2372 (2001).
14. H.J. Frost and M.F. Ashby, Deformation mechanisms maps. 1982, Oxford: Pergamon Press.
15. M.D. Thouless, Annu. Rev. Mater. Sci. 25, 69-96 (1995).
16. Y.-L. Shen and S. Suresh, Acta Met. Mat. 43, 3915-3926 (1995).
17. O. Bostrom, Wafer shape control - Study of the reactivity in Ti/Al dual layers and its effect on the stress, 2001, Université d'Aix-Marseille III, Faculté des Siences et Techniques de Saint-Jérôme: Marseille, France. p. 155.
18. D. Josell, T.P. Weihs, and H. Gao, MRS Bulletin 27 39-44 (2002).
19. D Gerth, D. Katzer, and M. Krohn, Thin solid films 208 67-75 (1992).
20. D. Jawarani, H. Kawasaki, I.-S. Yeo, L. Rabenberg, J.P. Starck, and P.S. Ho, J. Appl. Phys. 82 171-181 (1997).
21. O. Kraft, L.B. Freund, R. Philips, and E. Arzt, MRS Bulletin 27 30-37 (2002).
22. G. Dehm, D. Weiss, and E. Arzt, Mat. Sci. & Eng. A 309-310 468-472 (2001).
23. M.J. Kobrinsky and C.V. Thompson, Acta Mat. 48 625-633 (2000).
24. G. Dehm and E. Arzt, Appl. Phys. Let., 77, 1126 (2003).
25. G. Dehm, B. Inkson, T. Wagner, T.J. Balk and E. Arzt, J. Mater. Sci. Technol. 18, 2, 113-117 (2003).
26. M. Legros, G. Dehm, R.M. Keller-Flaig, E. Arzt, K.J. Hemker, and S. Suresh, Mat. Sci. & Eng. (2000).
27. M. Legros, K.J. Hemker, A. Gouldstone, S. Suresh, R.-M. Keller-Flaig, and E. Arzt, Acta Mat. 50 3435-3452 (2002).
28. O.S. Leung, Studies in the strengthening mechanisms of thin polycristalline gold films, Materials Science. 2001, Stanford University: Stanford.
29. B. Kaouache, P. Gergaud, O. Thomas, O. Bostrom, and M. Legros, Submitted to Microelectronic Engineering (2003).
30. T.R. Dalbec, O.S. Leung, and W.D. Nix in Deformation, Processing, and Properties of Structural Materials., edited by E.M. Taleff, C.K. Syn, and R. Lesuer (TMS - Miner. Metals & Mater. Soc, Warrendale, PA, 2000) pp. 95-108.
31. K.E. Harris and A.H. King, Acta Mat. 46 6195-6203 (1998).
32. K. Owusu-Boahen and A.H. King, Acta Mat. 49 237-247 (2001).
33. A. Witrouw, J. Proost, P. Roussel, P. Cosemans, and K. Maex, J. Mater. Res. 14 1246-1254 (1999).
34. G.J. Leusink, J.P. Lokker, M.J.C. van den Homberg, J.F. Jongste, T.G.M. Oosterlaken, G.C.A.M. Janssen, and S. Radelaar, Appl. Surf. Sci. 91 215-219 (1995).
35. R. Venkatraman and J.C. Bravman, J. Mater. Res. 7 2040 (1992).
36. S. Bader, E.M. Kalaugher, and E. Arzt, Thin Solid Films 263 175 (1995).
37. J. Koike, S. Utsunomiya, Y. Shimoyama, K. Maruyama, and H. Oikawa, J. Mater Res. 13 3256-3264 (1998).
38. M.D. Thouless, J. Gupta, and M.J.E. Harper, J. Mater. Res. 8 1845-1852 (1993).
39. Y.-L. Shen, S. Suresh, M.Y. He, A. Bagchi, O. Kienzle, M. Ruhle, and A.G. Evans, J. Mater. Res. 13 1928-1937 (1998).
40. S.P. Baker, R.-M. Keller, and E. Arzt in Mat. Res. Soc., edited by 1998.
41. P. Müllner and E. Arzt in Mat. Res. Soc. Symp. Proc., edited by 1998. Boston, MA.
42. H. Gao, L. Zhang, W.D. Nix, C.V. Thompson, and E. Arzt, Acta Materialia 47 2865-2878 (1999).
43. D. Weiss, H. Gao, and E. Arzt, Acta Materialia 49 2395-2403 (2001).
44. M. Hershkovitz, I.A. Blech, and Y. Komem, Th. Sol. Films 130 87-93 (1985).
45. D.-K. Kim, B. Heiland, W.D. Nix, E. Arzt, M.D. Deal, and J.D. Plummer, Thin Solid Films 371 278-282 (2000).
46. I. Dutta, M.W. Chen, K. Peterson, and T. Shultz, Journal of Electronic Materials 30 1537-1548 (2001).
47. G. Dehm, T.J. Balk, H. Edongue, and E. Arzt, submitted to Microelectronic Eng., 2003